Ferrotec introduced foreign advanced 4” (100mm) to 8” (200mm) semiconductor wafer processing equipment and manufacturing process with high precision and high quality performance. Main products include single crystal ingot of 100mm, 125mm, 150mm, 200mm, single-side polish wafer and double-side polish wafer, which possess good control in resistivity, flatness, particle, COP and metal contamination, etc., and are mainly used in various fields such as memory, logic integrated circuit, power device and sensor, etc. They can be also directly applied to varieties of silicon substrates like CMOS, EPI and SOI, etc.
Based on annual capacity of 4.2 million pieces for 4”~6” semiconductor wafer and 1.8 million pieces for 8” semiconductor wafer, and in the 2nd half year of 2017, Ferrotec (China) invested 6 billion yuan together with its partner to launch big size wafer project of 8” wafer and 12” waferwith annual capacity of 3.6 million pieces and 2.4 million pieces respectively, through which torealize large scale production for 8” and 12” semiconductor wafer. It is expected to start pilot production in January 2019 and officially put into operation in April.
The completion of the semiconductor wafer project will fill the blank of mass production of 8” and larger wafers in China, break the monopoly of foreign companies on the Chinese market of semiconductor wafer, and realize the real dream of "Made in China" in the Chinese semiconductor manufacturing industry.
