On May 9, Jiangsu fulehua Power Semiconductor Research Institute started to lay the foundation in Dongtai high tech Zone, marking that Jiangsu fulehua's research in the field of power semiconductor has entered a higher level, and that Jiangsu fulehua will join hands with Dongtai high tech Zone to develop to a new level.
Chen Xiaojun, director of the Standing Committee of Dongtai Municipal People's Congress, Bao Yu, chairman of Dongtai Municipal People's Political Consultative Conference, Qiu Haitao, Secretary of the Party group of Dongtai Municipal People's Political Consultative Conference, Xu Yue, vice mayor of Dongtai Municipal People's government, Chen Lijun, Secretary of the party Working Committee of high tech Zone, Lu Kelin, deputy secretary of the Party Working Committee and director of the Management Committee of high tech Zone, representative of Japan Magnetic Technology Holding Co., Ltd., chairman of the board of directors of Ferrotec (China), and He Xianhan, chairman of Jiangsu fuluohua Power Semiconductor Research Institute Co., Ltd., Zhang Enrong, general manager of Jiangsu fuluode Semiconductor Technology Co., Ltd. and Jiangsu fuluohua Power Semiconductor Research Institute Co., Ltd., and Dr. Wang Bin, director of R & D Department of Jiangsu fuluode Semiconductor Technology Co., Ltd. and Jiangsu fuluohua power semiconductor research Institute Co., Ltd, Zhao Shanqi, chairman and general manager of Jiangsu Hongwei Technology Co., Ltd., attended the foundation laying ceremony.
Jiangsu fulehua power semiconductor research institute is a new research and development institution established by Jiangsu fulade Semiconductor Technology Co., Ltd., which is jointly established by Dongtai high tech Zone, domestic research institute, University and power semiconductor related enterprises. After the completion of the Research Institute, it will play a great role in promoting the development of fullerde company and power device industry.
The Research Institute focuses on the development and reliability testing of semiconductor power module packaging technology, focusing on the material structure and failure analysis, packaging structure design and simulation, advanced power semiconductor connection technology, analysis and test, etc. The Research Institute focuses on the development of advanced power semiconductor carrier and sealing technology, and promotes the packaging and application technology for power semiconductor module carrier, meets the test requirements of power semiconductor module manufacturers, and can greatly promote the rapid development of power semiconductor and enhance the global influence of China semi conductor technology.
The project is planned to invest RMB 200million, with a land area of about 30 mu, a building area of 28000 square meters, recruiting 50-100 high-level R & D technicians, purchasing more than 40 sets of equipment such as magnetron sputtering machine, high temperature gate pole test platform, power cycle test and streamer, and building power semiconductor Research Institute, including power semiconductor technology center, material structure and failure analysis laboratory Analysis and test center, silicon nitride pilot production workshop and supporting expert building, etc. The project is put into construction in two phases, with the investment of 120million yuan in the first phase, which will be completed by the end of 2021, the second phase with an investment of 80million yuan and completed by the end of 2022. This project is a project integrating the technical design, research and development of power semiconductor products and experimental production, which carries the industrialization project and industrial cooperation, and serves the relevant leading industries. After the completion of the project, it will integrate the technical design, research and development, test and production of power semiconductor products to provide services for well-known semiconductor enterprises at home and abroad. In the future, the expansion of business will reach the industries of electric vehicles, new energy Internet, intelligent transportation and communication. The relevant test platform and test production business are expected to form an annual output value of 100million yuan.
